ICP - ICPackaging Technology Expo 2024

ICP Exhibition is the exhibition of packaging technology for semiconductors, LEDs, MEMS, sensors. The areas covered by the Fair include: - Equipment for the assembly. - Inspection Equipment - Packaging Materials - Simulation and analysis software for IC Packaging

• Industries: Packaging materials, Packaging design, Printing machinery, Printing, Packaging, Printing and graphics
• Frequency: anual
• Scope: Internacional

• From Wednesday 17 to Friday 19 January 2024
• Venue: Tokyo Big Sight, Tokyo International Exhibition Center
• City: Tokyo
• Country: Japan
• More info.: nepconjapan.jp